At Spares Universe,we provide safe, durable, and affordable NSN part fulfillment solutions for customers within a wide variety of industries. This includes our selection of dependable Microcircuit Memory items like NSN 5962-01-260-3008. If you are interested in purchasing part number BCM-23C64D-8168 by Allegro Microsystems Inc, we encourage you to begin by submitting the Request for Quote (RFQ) form below to receive a competitive quote in 15 minutes or less. Using the details you provide in your form, including shipping deadlines, desired quantities, and more, we will find a solution for sourcing part number BCM-23C64D-8168 that caters to your particular situation.
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Part number BCM-23C64D-8168 is produced by Allegro Microsystems Inc under the CAGE Code 31019, and this manufacturer is a trusted entity on our Approved Vendor List (AVL) who follows a strict level of quality assurance in their practices. They are also part of our vast supply network which allows for expedited shipping solutions for domestic and international customers alike. If you would like to explore other products with the NSN 5962-01-260-3008 or similar parts, we invite you to check out our page of 5962 Microcircuits Electronic products or look at the list of related items below.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-260-3008 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012603008 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 260320-9003 | 5 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.595 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.165 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/125.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 5895-01-146-6736 DIGITAL COMMUNI |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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