At Spares Universe,we provide safe, durable, and affordable NSN part fulfillment solutions for customers within a wide variety of industries. This includes our selection of dependable Microcircuit Memory items like NSN 5962-01-245-3441. If you are interested in purchasing part number IMS1600S-70M by Sgs Thompson Microelectronics Inc, we encourage you to begin by submitting the Request for Quote (RFQ) form below to receive a competitive quote in 15 minutes or less. Using the details you provide in your form, including shipping deadlines, desired quantities, and more, we will find a solution for sourcing part number IMS1600S-70M that caters to your particular situation.
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Part number IMS1600S-70M is produced by Sgs Thompson Microelectronics Inc under the CAGE Code 60911, and this manufacturer is a trusted entity on our Approved Vendor List (AVL) who follows a strict level of quality assurance in their practices. They are also part of our vast supply network which allows for expedited shipping solutions for domestic and international customers alike. If you would like to explore other products with the NSN 5962-01-245-3441 or similar parts, we invite you to check out our page of 5962 Microcircuits Electronic products or look at the list of related items below.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-245-3441 Item Description: Microcircuit Memory | 5962 | 012453441 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ims1600s-70m | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 19 INPUT |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND W/ENABLE |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.310 INCHES MAXIMUM |
| TTQY | Terminal Type And Quantity | 22 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| ADAQ | Body Length | 1.111 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.180 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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